Copper Nanoparticles
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Copper Nanoparticles Powder
| MF: | Cu |
| Chemical Name: |
Copper Nanoparticles |
| Purity: | > 99.99% |
| APS: | 25 nm (Size Customization possible) |
| Form: | Nanopowder/Dispersion |
| Product Number: | #NCZ2101 |
| CAS Number | 7440-50-8 |
Application:
The key applications of copper nanoparticles are listed below:
Copper nanoparticles based ink for screen printed circuits and electrode fabrication for electrochemistry.
Acts as an antibiotic, anti-microbial, and anti-fungal agent when added to plastics, coatings, and textiles. Copper diet supplements with efficient delivery characteristics. High strength metals and alloys.
Copper plays an important role in electronic circuits because of its excellent electrical conductivity and ideal material for Thermal, electronic, and biomedical applications such as antimicrobial, Dental Health care and antiviral mask, and gloves coating.
Please contact us for customization and price inquiry.
Note: We supply different size products of micro and Nano Size range dispersion according to the client’s requirements.
Note: For pricing & ordering information, please contact us at sales@nanochemazone.com
Please contact us for quotes on Larger Quantities & Customization. E-mail: contact@nanochemazone.com
Customization:
If you are planning to order large quantities for your industrial and academic needs, please note that customization of parameters (such as size, length, purity, functionalities, etc.) are available upon request.
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| CAS | 7429-90-5 |
| Purity | 99.9% |
| APS | < 100 nm (customization available) |
| Melting Point | 271 ˚C |
| SSA | 20 m2/g |
| Boiling Point | 143.-1560 ˚C |
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| Purity | 99.9 % |
| APS | 60-80 nm (customization available) |
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| Molecular Weight | 112.41 g/mol |
| Form | Powder |
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| Young's Modulus | 50 GPa |
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Technical Parameter:
| Product Name | MF | Purity | Particle Size | Melting Point | Density | Color |
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| pH | 6.6 |
| Silica Coating Thickness | 10-15 nm (customization available) |