Copper Nanoparticles Dispersion
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Copper Nanoparticles Dispersion
| MF: | Cu |
| Chemical Name: | Copper Dispersion |
| Purity: | >99.99% |
| APS: | 50 nm (Size Customization possible) |
| Form: | Nano dispersion |
| Product Number: | NCZD401 |
| CAS Number | 7440-22-4 |
Copper Nanoparticles Applications:
The key applications of copper nanoparticles are listed below:
Copper nanoparticles based ink for screen printed circuits and electrode fabrication for electrochemistry.
Acts as an anti-biotic, anti-microbial, and anti-fungal agent when added to plastics, coatings, and textiles. Copper diet supplements with efficient delivery characteristics. High strength metals and alloys.
Copper plays an important role in electronic circuits because of its excellent electrical conductivity and ideal material for Thermal, electronic, and biomedical applications such as antimicrobial, Dental Health care and antiviral mask, and gloves coating.
Please contact us for customization and price inquiry.
Note: We supply different size products of micro and Nano Size range dispersion according to the client’s requirements.
Note: For pricing & ordering information, please contact us at sales@nanochemazone.com
Please contact us for quotes on Larger Quantities & Customization. E-mail: contact@nanochemazone.com
Customization:
If you are planning to order large quantities for your industrial and academic needs, please note that customization of parameters (such as size, length, purity, functionalities, etc.) are available upon request.
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Alumina Slurry Polishing (Al2O3, Purity: 99.9 %, APS: 50-80 nm)| Product | Alumina Slurry Polishing |
| CAS | 1344-28-1 |
| Product Number | NCZ-D-1501N |
| APS | 50-80 nm (Size Customization is possible) |
| Purity | 99.9% |
| Form | Liquid |
| Colour | White |
| pH value | 4-5 |
| Concentration | 10 wt% to 40% (Available as per Customer requirement) |
| Dispersing Agent | Organic Solvent (DMF), IPA Ethanol, Toluene, Water (H2O) |
| Available Quantities | 10 ml, 50 ml, 100 ml, 250 ml, and larger Industrial quantities |
Bismuth Oxide Dispersion
| Product | Bismuth Oxide Dispersion |
| CAS | 1304-76-3 |
| Product Number | NCZ-D-1502N |
| APS | < 1µm |
| Purity | 99% |
| Molecular Formula | Bi2O3 |
| Form | Liquid |
| Molecular Weight | 465.96 g/mol |
| Concentration | 10 wt% |
| Solubility | Soluble in Water + IPA |
Boron Nitride Nanoparticles Dispersion
| Product Number | NCZ-D-1504N |
| CAS | 10043-11-5 |
| APS | 80-100 nm (Size Customization is possible) |
| Purity | 99.99 % |
| Molecular Formula | BN |
| Molecular Weight | 24.82 g/mol |
| Form | Liquid |
| Density | 1.9-2.1 g/cm3 |
| Thermal Expansion | 0.54 to 18 µm/m-K |
| Passion Ration | 0.11 |
| Young’s Modulus | 14 to 60 GPa |
Silicon Dioxide Dispersion
| MF: | SiO2 |
| Chemical Name: | Silicon Dioxide Dispersion |
| Purity: | > 99.99% |
| APS: | 30 nm (Size Customization possible) |
| Form: | Nano dispersion |
| Product Number: | NCZD2701 |
| CAS Number | 7631-86-9 |
Silver Colloidal Dispersion
| MF: | Ag |
| Chemical Name: | Silver Colloidal Dispersion |
| Purity: | >99.99% |
| APS: | 20 nm (Size Customization possible) |
| Form: | Nano dispersion |
| Product Number: | NCZD1002 |
| CAS Number | 7440-22-4 |
Silver Copper Alloy Dispersion
| MF: | Ag |
| Chemical Name: | Silver Copper Alloy Dispersion |
| Purity: | >99.99% |
| APS: | <80 nm (Size Customization possible) |
| Form: | Nano dispersion/Nanopowder/ Dried Nanoparticles |
| Product Number: | NCZD1003 |
| CAS Number | 7440-22-4/7440-50-8 |
SWCNT Water Dispersion
| MF: | SWCNT |
| Chemical Name: | SWCNT Water Dispersion |
| Purity: | >99.99% |
| APS: | 1-2 nm Diameter (Size Customization possible) |
| Form: | Dispersion |
| Product Number: | NCZD2802 |
| CAS Number | 308068-56-6 |
Zinc Nanoparticles Dispersion
| MF: | Zn |
| Chemical Name: | Zinc nanoparticles Dispersion |
| Purity: | >99.99% |
| APS: | 50 nm (Size Customization possible) |
| Form: | Dispersion |
| Product Number: | NCZD1201 |
| CAS Number | 7440-66-6 |
