Single Crystal Silicon-Silicon dioxide Wafer
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Single Crystal silicon-silicon dioxide Wafer
Product Name: Single Crystal silicon-silicon dioxide Wafer
| Product Name | Single Crystal silicon-silicon dioxide Wafer P-type (4 inches) |
| Cat No. | NCZ-NSC318/20 |
| Día | 100 mm (4 inches) |
| Orientation | <100> |
| Wafer thickness | 500 micrometer |
| Resistivity | <0.01 |
| Polished | Front Side Polished |
| Thickness | 300 nm (dry) |
| Purity | 99.9% |
| Formula | Si/SiO2 |
Single Crystal silicon-silicon dioxide Wafer P-type Description :
Provided in a single wafer case
Silicon oxide wafer SIO2 thin-film among semiconductor technology, SiO2 thin film layers are mainly used as dielectric material and more recently, they are integrated with MEMS (Micro Electro Mechanical Systems) devices. The simplest way to produce silicon oxide layers on silicon wafers is to oxidize silicon with oxygen.
Single Crystal silicon-silicon dioxide Wafer RELATED INFORMATION
Storage Conditions:
Airtight sealed, avoid light and keep dry at room temperature.
Please email us for the customization.
Email: contact@nanochemazone.com
Note: We supply different size ranges of nano and micron size powder as per the client’s requirements and also accept customization in various parameters.
Note: For pricing & ordering information, please contact us at sales@nanochemazone.com
Please contact us for quotes on Larger Quantities & Customization. E-mail: contact@nanochemazone.com
Customization:
If you are planning to order large quantities for your industrial and academic needs, please note that customization of parameters (such as size, length, purity, functionalities, etc.) are available upon request.
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| Product Name | Single crystal silicon wafer Intrinsic (2-inch) |
| Cat No. | NCZ-NSC329/20 |
| Diameter | 2 inch |
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| Resistivity | (>1000ohm/sq.) |
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| Orientation | 100 |
| Polished | Single side polished |
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Product Name: Single Crystal Silicon Wafer N-Type (3-inch)
| Product Name | Single Crystal Silicon Wafer N-Type (3-inch) |
| Cat No. | NCZ-NSC333/20 |
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| Resistivity | (1-10 Ohm/sq). |
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| Orientation | 100 |
| Polished | Single side polished |
| Form | crystalline (cubic (a = 5.4037) |
| Polished | wafer (single side polished) |
| does not contain | dopant |
| Día | 2 inch |
| Thickness | 0.5 mm |
| Boling Point | 2355 °C (lit.) |
| Melting Point | 1410 °C (lit.) |
| Density | 2.33 g/mL at 25 °C (lit.) |
| Semiconductor properties | <100>, N-type |
| SMILES string | [Si] |
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Single crystal silicon wafer P-Type (2 inches) Description:
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